SOIL

Solidify the European FDSOI ecosystem accelerating its industrial deployment

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EuroSOI-ULIS 2025 >>
• Date : May 14th-16th, 2025
Warsaw, Poland

Leti Semicon Workshop >>
• Date : July 9th, 2024
San Francisco, USA

EuroSOI-ULIS Conference 2024 >>
• Date : May 15th-17th, 2024
Glyfada, Greece

The European-originated fully depleted silicon on insulator (FDSOI) family of semiconductor technologies is recognized for its low power consumption, versatility, exceptional radio frequency capabilities, high radiation hardness and overall reliability and process simplicity.

Several previous (e.g. OCEAN12) and currently running (e.g. BEYOND5) cooperative programs have supported those technologies and associated developments. New applications are arising necessitating new platform expansions and thus, further research.

The overreaching goal of SOIL is to further expand the European FDSOI ecosystem and platforms to increase the impact on European economy, which is largely dependent on semiconductor components. The project aims to provide solutions across a large value chain with the additional consequence to enhance its resilience against future crises, fully in line with the objectives of the recently adopted European Chips Act.

SOIL project will thus expand a European technology manufactured by European players and suited to the European and Worldwide markets, notably by increasing investment in FDSOI research and development across the value chain, fostering collaboration between academia and industry, promoting FDSOI technology adoption. It will encourage transnational cooperation expanding the range of addressed applications and develop a skilled workforce.

SOIL project will give Europe the opportunity to move forward with industrial and academic players spanning the value chain by joining in the risk-taking necessary for the growth dynamics of semiconductors for Automotive, Space, IOT and Edge AI domain in Europe, supporting the twin green and digital transition.

The dominant strategic objective of SOIL project is to provide the European downstream market players with a reliable source of these important electronic components and systems based on an entirely European FDSOI semiconductor value chain, ranging from substrate to systems.

The technical excellence, in all four domains (materials/substrates, silicon IP design, chip design, innovative demonstrators) achieved by the project will significantly strengthen the competitive position of European technology in the global market. SOIL will strongly expand the family of European FDSOI technology platforms, beyond the state of the art to serve larger emerging markets such as automotive IOT and Edge AI, by devel-oping production capabilities and innovation in the following key areas:

  • Advanced technology: expand current and prepare next generations of FDSOI technologies & components;
  • Semiconductor Intellectual Property (SIP) core: reinforce the FDSOI design ecosystem and the sup-ply chain around FDSOI manufacturing;
  • Digital, analog & RF single-chip integration capabilities (Microcontroller Unit; RF communication; RF sensor, e.g. radar), enable cost-efficient, unique featured, and competitive European products.
  • Application demonstrations in the field of automotive, IOT, Space and communication;
  • European actors of SOIL span the entire value chain, ensuring maximum impact at all levels:
  • Materials and technology platforms with Soitec, GF, STM, IBS, Silvaco, CEA, UCL and UPB
  • IP generation and promotion with Bosch, CEA, SIAE, IMST, Argus, D&R, IC-Logic, UNICAL, Grenoble INP, Bordeaux INP, IMEC, Fraunhofer, ETHZ, UTIA, UCL, ECL
  • Advanced components with STM, CEA, Bosch, ISD, IMST, TAS, SIAE, NAM, Fraunhofer, IMA, UTIA, TU/e
  • Systems demonstrators with Bosch, AED, ANTENNEX, CEA, Citrobits, GreenWaves, ISD, TU/e, Fraunhofer, IMA, UTIA

The project will shape the future of FDSOI, by developing new technology approaches as well as numerous IPs (technology, silicon IPs, system solutions) on advanced applications and will promote the capability and benefits of the technology by providing seven advanced demonstrations on key applications and showing significant advances beyond the state of the art.

SOIL is therefore the path towards FDSOI technologies adoption, the preparation of future technologies and challenges. It will enable and stimulate the growth of the European semiconductor industrial base, progressing toward higher independence of Europe in this field.