WP2 - SOI Technology Platform

O1 - enhancement of Smart Engineering FDSOI substrates

Objective O1 is to develop advanced engineering substrates bringing digital, analog & RF performances to meet upcoming application domains (MCU, MPU ...). Energy efficiency will be also considered in the substrate platform development.

O2 - enablement & enhancement of FDSOI platform

Objective O2 is to increase competitiveness of the FDSOI platform for Automotive and Image Sensor Processor applications in terms of operating voltage and RF properties.

O3 - Readiness for upcoming FDSOI technologies

Objective O3 is to bring booster to advanced FDSOI substrate platform with strained SOI and improves embedded non-volatile memories for micro controllers applications.