WP4 - Component Development

O4.1: To demonstrate through various technology flavours (28nm FDSOI, 22FDX and 18nm FDSOI), FDSOI is not a dedicated technology but a multipurpose one. As FDSOI is European born, and soon fully European manufactured, designing a large diversity of FDSOI chips to address the most strategic areas of the European industry and simultaneously offer world-leading characteristics, is a mandatory stepping stone toward Europe 'silicon sovereignty' recovery.

O4.2: To demonstrate FDSOI technology is suitable for complex chip designs integrating circuit blocks that are traditionally touchy to develop (and fine tune) such as RF interfaces.

O4.3: To demonstrate FDSOI circuits can cope with stringent (certification , long lasting aspects, aggressive environments etc...) segment requirements such as automotive, space or telecommunications.

O4.4: To demonstrate FDSOI circuits are able to offer an high level of computational capabilities requested by new application field such as edge AI, multi target radars or satellite .

O4.5: To demonstrate we can reach O4.2 and/or O4.3 and/or O4.4 and simultaneously offer significant/drastic power consumption reduction such that circuits designed in the frame of WP4 are contributing to reduce the power consumption of the system they are integrated in, and thus reduce its environmental impact.

Leader : STM
Involved Partners :
Involved Partners : Bosch, CEA, IMA, IMST, ISD, NAM, SIAE, ST Alps, ST France SAS, ST ROUSSET, STM CROLLES, TAS, TU/e, UNICAL, UTIA