T2.1 FDSOI substrate enhancement
Task 2.1 deals with innovative substrate platform development to pursue the evolutionary scaling roadmap for advanced technology nodes.Soitec will develop advanced substrates platforms as illustrated in the roadmap below. The platform eSoC.2 HR will bring RF performances while eSoC.3 will provide strong adder substrate performances (thickness control, defectivity) for high edge computing & high speed connect applications. We will also focus on developing technology bricks increasing energy efficiency (chemical waste, electricity, ...) that can serve the different substrate flavors. eSoC3+ booster technology is also considered in the FDSOI substrate roadmap and will be related to Task 2.3 for upcoming technologies.- Platform advanced nodes eSoC.3 - Soitec
- Soitec delivers today high volume manufacturing substrates with a uniformity thickness control at +/-4Ã… and a roughness < 8Ã… (6 sigma measured by Differential Reflectometry Metrology). The challenges for the eSoC.3 platform will be to go further for those performances and reach a control at +/-3.5Ã… with an homogeneous roughness < 6Ã….
- Platform HR compatibility eSoC.2 HR - Soitec
- The challenge for eSoC.2 HR will be to combine eSoC.2 performances (thickness control at +/-4Ã…, defectivity with no slip lines...) and HR compatibility thanks to a High Resistivity handle wafer. Technical challenges will be mainly focused on material side (Interstitial Oxygen concentration [Oi] control) & process interactions (thermal processes) to obtain the right substrate performances.
- Energy efficiency - Soitec
- Finally, water consumption and energy savings will be evaluated for the development of an Energy efficiency substrate.
- Challenges addressed:
- eSoC.2 HR platform to enable High Resistivity compatibility with FDSOI substrates and combining RF & digital co-integration
- eSoC.3 platform to push the substrate key parameters to ultimate performances for more Intelligence, high connectivity and edge computing
- Energy efficiency approach in substrate development to contribute to the global energy challenges
Leader : SOITEC
Involved Partners : CEA