T2.1 FDSOI substrate enhancement

Task 2.1 deals with innovative substrate platform development to pursue the evolutionary scaling roadmap for advanced technology nodes.Soitec will develop advanced substrates platforms as illustrated in the roadmap below. The platform eSoC.2 HR will bring RF performances while eSoC.3 will provide strong adder substrate performances (thickness control, defectivity) for high edge computing & high speed connect applications. We will also focus on developing technology bricks increasing energy efficiency (chemical waste, electricity, ...) that can serve the different substrate flavors. eSoC3+ booster technology is also considered in the FDSOI substrate roadmap and will be related to Task 2.3 for upcoming technologies.
Leader : SOITEC
Involved Partners : CEA